NXP recommends a thermal pad layout with a minimum size of 2.5 mm x 2.5 mm, and a thermal via array with a minimum of 9 vias, 0.3 mm in diameter, and 1.5 mm deep to minimize thermal resistance.
To ensure reliable operation, NXP recommends derating the maximum junction temperature (Tj) by 10°C for every 1,000 meters above sea level, and using a heat sink with a thermal resistance of ≤ 10 K/W to keep the junction temperature below 150°C.
The maximum allowed voltage transient for BYV25D-600,118 is ±2 kV, according to the IEC 61000-4-5 standard, to ensure the device's reliability and prevent damage.
Yes, you can use multiple BYV25D-600,118 devices in parallel to increase the current handling capability, but ensure that the devices are properly matched, and the current sharing is balanced to prevent overheating and reduce reliability.
NXP recommends storing BYV25D-600,118 in a dry, cool place with a relative humidity of ≤ 60% and a temperature range of -40°C to 30°C to prevent moisture damage and ensure reliability.
BYV25D-600,118 datasheet
by NXP Semiconductors
