The maximum safe operating area (SOA) for the BUX87 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. As a general rule, it's recommended to keep the device within the SOA to prevent thermal runaway and ensure reliable operation.
To ensure the BUX87 is properly biased for linear operation, you should ensure that the base-emitter voltage (VBE) is within the recommended range (typically around 0.6-0.7V) and that the collector-emitter voltage (VCE) is sufficient to maintain a linear operating region. You may need to adjust the base resistor values and/or the collector load to achieve this.
For optimal thermal management, it's recommended to use a heat sink with a thermal resistance of around 10-20°C/W. The PCB layout should ensure good thermal conductivity and minimal thermal resistance between the device and the heat sink. A copper pour or thermal vias can help to dissipate heat efficiently.
To protect the BUX87 from electrostatic discharge (ESD), it's recommended to use ESD protection devices such as TVS diodes or ESD protection arrays on the input and output pins. You should also follow proper handling and storage procedures to prevent ESD damage.
For optimal soldering and assembly, it's recommended to use a controlled soldering iron temperature (around 250-270°C) and a solder with a low melting point (around 180-200°C). Avoid applying excessive heat or mechanical stress during assembly, and ensure that the device is properly seated and aligned on the PCB.
BUX87 datasheet
by STMicroelectronics
