STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and storage temperature (Tstg). Additionally, consider using a heat sink, thermal interface material, and ensuring good airflow around the device.
To minimize EMI and RFI, use a shielded layout, keep sensitive traces away from the BUX48C, and use decoupling capacitors to filter out high-frequency noise. Also, consider using a common-mode choke or ferrite beads to suppress common-mode noise.
Use a voltage regulator or a transient voltage suppressor (TVS) to protect the device from overvoltage conditions. For overcurrent protection, consider using a current-limiting resistor or a fuse in series with the device. Additionally, ensure that the PCB layout can handle the maximum current rating of the device.
STMicroelectronics recommends using a soldering temperature of 260°C (max) and a reflow time of 30 seconds (max) to prevent damage to the device. For rework, use a low-temperature soldering iron (220°C max) and avoid applying excessive force or pressure to the device.
BUX48C datasheet
by STMicroelectronics
