The maximum safe operating area (SOA) for the BUT90 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance, maximum junction temperature, and power dissipation. As a general rule, it's recommended to keep the device within the SOA to ensure reliable operation and prevent damage.
To ensure the BUT90 is properly biased, follow the recommended biasing scheme in the datasheet, which includes setting the base-emitter voltage (VBE) and collector-emitter voltage (VCE) within the specified ranges. Additionally, ensure the device is operated within the recommended temperature range and that the power supply is stable and noise-free.
For optimal performance and thermal management, it's recommended to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using thermal vias to dissipate heat. Additionally, ensure the device is mounted on a heat sink or thermal pad, and that the PCB is designed to minimize thermal resistance.
To protect the BUT90 from ESD, follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and ensuring that all equipment and tools are properly grounded. Additionally, consider adding ESD protection devices, such as TVS diodes or ESD protection arrays, to the PCB design.
The reliability and lifetime expectations for the BUT90 are dependent on various factors, including operating conditions, temperature, and usage patterns. However, STMicroelectronics provides reliability data and failure rates for the device in the datasheet and application notes. It's recommended to consult these resources and perform thorough reliability testing to ensure the device meets the required specifications.
BUT90 datasheet
by STMicroelectronics
