STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for voltage and current. Additionally, ensure good thermal design, use a heat sink if necessary, and consider using a thermistor or thermal monitoring IC to prevent overheating.
The BUR52 is designed to handle surge currents up to 100A for 10ms, but it's essential to consider the application's specific requirements and ensure the device is not subjected to repetitive surge events, which can reduce its lifespan.
While the BUR52 is suitable for high-frequency switching applications, it's crucial to consider the device's switching losses, which can increase with frequency. Ensure the device is operated within its recommended frequency range, and consider using a snubber circuit to reduce electromagnetic interference (EMI).
To protect the BUR52 from EOS, use a transient voltage suppressor (TVS) or a metal-oxide varistor (MOV) in parallel with the device. Additionally, ensure the device is operated within its recommended voltage and current ratings, and consider using a fuse or a current limiter to prevent excessive current.
BUR52 datasheet
by STMicroelectronics
