STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
Although the datasheet doesn't explicitly state the maximum allowed voltage on the input pins, it's generally recommended to limit the input voltage to the supply voltage (VCC) + 0.3V to prevent damage to the internal ESD protection diodes.
Yes, the BUL98 can be used as a high-side switch, but it's essential to ensure that the input voltage is within the recommended range and that the device is properly biased. Additionally, consider the power dissipation and thermal management when operating as a high-side switch.
To protect the BUL98 from EOS, use a combination of TVS (transient voltage suppression) diodes, resistors, and capacitors to limit voltage transients and spikes. Additionally, follow proper PCB design and layout guidelines to minimize parasitic inductance and capacitance.
BUL98 datasheet
by STMicroelectronics
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