A 2-layer or 4-layer PCB with a large copper area for heat dissipation is recommended. Ensure good thermal conductivity by using thermal vias and a solid ground plane.
Implement a proper thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid overheating by monitoring the device's junction temperature.
Monitor the device's current, voltage, and temperature. Implement overcurrent protection, overvoltage protection, and thermal shutdown to prevent damage.
Use a dedicated gate driver IC or a high-current, low-impedance gate drive circuit. Ensure a fast rise and fall time, and adjust the gate resistance to minimize power losses.
Handle the device by the body, not the leads. Use an anti-static wrist strap or mat to prevent electrostatic discharge. Avoid touching the device's pins or exposed metal parts.
