STMicroelectronics recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure good thermal dissipation.
To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet, and to ensure good thermal management through proper PCB design and heat sinking.
STMicroelectronics recommends a gate drive circuit with a low impedance output stage and a high current capability to ensure fast switching times and low power losses. A recommended gate drive circuit is shown in the application note AN2342.
To protect the device from overvoltage and overcurrent conditions, it is recommended to use a voltage clamp circuit and a current sense resistor in series with the device, along with a fuse or a current limiter to prevent damage from excessive currents.
For high-power applications, STMicroelectronics recommends a forced-air cooling system or a liquid cooling system to ensure effective heat removal and to prevent overheating.
BTW68-800RG datasheet
by STMicroelectronics
