A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A minimum of 2oz copper thickness is recommended for the PCB.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device, and to ensure good thermal management through proper heat sinking and airflow.
To prevent ESD damage, handle the device in an ESD-protected environment, use ESD-protected tools and equipment, and ensure that all personnel handling the device are grounded through a wrist strap or other ESD protection device.
The correct gate resistor value depends on the specific application requirements, including the switching frequency, gate drive voltage, and device characteristics. A general guideline is to use a gate resistor value between 10 ohms and 100 ohms, and to adjust the value based on the device's gate charge characteristics.
When paralleling multiple devices, it's essential to ensure that the devices are matched for current handling, and that the gate drive signals are synchronized to prevent current imbalance. Additionally, the PCB layout should be designed to minimize inductance and ensure good thermal management.
BTA26-800CWRG datasheet
by STMicroelectronics
