STMicroelectronics recommends a thermal pad on the bottom of the device, connected to a large copper area on the PCB to dissipate heat efficiently.
Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout. Also, consider derating the device's current handling capability at high temperatures.
A gate drive circuit with a low impedance output, a fast rise time, and a voltage swing of 10-15V is recommended. A gate resistor value of 10-20 ohms is suitable for most applications.
Use a transient voltage suppressor (TVS) or a metal-oxide varistor (MOV) to clamp voltage transients. Also, ensure proper PCB layout and routing to minimize electromagnetic interference (EMI).
Store the devices in their original packaging or in a conductive bag. Handle the devices with ESD-protective wrist straps or mats, and ensure the workspace is ESD-safe.