NXP recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for voltage and current. Additionally, ensure good thermal design, use a heat sink if necessary, and consider using a thermistor to monitor the device temperature.
The maximum allowed voltage on the gate pin is ±20V, but it's recommended to keep it within ±15V to ensure reliable operation and prevent damage to the device.
Use a voltage regulator or a voltage limiter to prevent overvoltage. For overcurrent protection, use a current limiter or a fuse in series with the device. Additionally, consider using a thermistor to monitor the device temperature and shut down the circuit if it exceeds a certain temperature.
The recommended gate resistor value is typically between 1 kΩ to 10 kΩ, depending on the specific application and switching frequency. A higher value can reduce EMI, but may increase switching losses.
BT137B-800G,118 datasheet
by NXP Semiconductors
