BQ78PL116RGZR datasheet by Texas Instruments

BQ78PL116RGZR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance of the BQ78PL116RGZR?
  A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the IC, and use short, wide traces for the power paths.
• How do I ensure the BQ78PL116RGZR is properly configured for my specific application?
  Use the TI Power Architect tool to configure the device and generate a configuration file. This tool helps optimize the device for your specific application requirements.
• What are the thermal considerations for the BQ78PL116RGZR, and how do I ensure it doesn't overheat?
  The device has a thermal shutdown feature that turns it off if the junction temperature exceeds 150°C. Ensure good airflow, use a heat sink if necessary, and follow the recommended PCB layout to minimize thermal resistance.
• Can I use the BQ78PL116RGZR in a high-reliability or safety-critical application?
  Yes, the BQ78PL116RGZR is designed for high-reliability applications and meets various safety standards, including IEC 61508 and ISO 26262. However, consult the datasheet and relevant standards for specific requirements and certifications.
• How do I troubleshoot issues with the BQ78PL116RGZR, such as unexpected shutdowns or output voltage deviations?
  Use an oscilloscope to monitor the input and output voltages, and check the device's fault flags and status registers. Consult the datasheet and application notes for troubleshooting guidelines and fault detection techniques.