Texas Instruments recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure good thermal dissipation. A minimum of 2 oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a heat sink if necessary, and ensure good airflow around the device. Additionally, consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
Texas Instruments recommends using a low-ESR ceramic capacitor with a value of 10 μF to 22 μF for the input capacitor (CIN). This helps to filter out high-frequency noise and ensure stable operation.
To troubleshoot issues with output voltage regulation, check the input voltage, output load, and feedback resistors (RFBT and RFBG) for correct values and connections. Also, verify that the output capacitor (COUT) is properly sized and connected. If issues persist, consult the datasheet's troubleshooting section or contact Texas Instruments support.
The BQ4850YMA-85N can tolerate input voltage ripple up to 10% of the nominal input voltage. Exceeding this limit may affect the device's performance and reliability.