A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces short and away from digital signals. Use a 50-ohm microstrip line for the RF output.
Use the SPI interface to configure the device in low-power mode (LPM) when not transmitting. Adjust the transmit power level and data rate to minimize power consumption. Use the built-in power management features, such as the power-down mode and voltage regulator.
The maximum operating temperature range for the BGY66B,112 is -40°C to +125°C. However, the device's performance may degrade at extreme temperatures. Ensure proper thermal design and heat dissipation to maintain optimal performance.
Use a shielded enclosure, and ensure the PCB is designed with EMC in mind. Use filtering and shielding on the RF output, and keep the device away from other RF sources. Follow the guidelines in the NXP application note AN11529 for EMC design considerations.
Use a 50-ohm antenna with a quarter-wavelength monopole or a dipole antenna. The antenna should be designed to operate at the desired frequency band (2.4 GHz or 5 GHz). Use a balun or a matching network to ensure impedance matching.
BGY66B,112 datasheet
by NXP Semiconductors
