A good PCB layout for the BDW94C should include a large copper area for heat dissipation, with multiple vias connecting the top and bottom layers. This helps to reduce thermal resistance and improve heat transfer.
To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer between the device and heat sink.
For EMI filtering and noise reduction, use a pi-filter configuration with a common-mode choke, and ensure that the filter components are placed close to the BDW94C. Also, use a shielded cable for the output and consider adding a ferrite bead to the input for additional noise reduction.
To optimize the output filter design, use a combination of capacitors with different values and types (e.g., ceramic, electrolytic, and film capacitors). This helps to reduce ripple and noise across the frequency spectrum. Additionally, consider using a snubber circuit to reduce high-frequency noise.
For testing and measurement, use a high-impedance probe to measure the output voltage, and ensure that the oscilloscope is set to the correct bandwidth and sampling rate. Also, use a current probe to measure the output current, and consider using a thermal camera to monitor the device temperature.
BDW94C datasheet
by STMicroelectronics
