A good PCB layout for the BDW93C should include a large copper area for heat dissipation, with multiple vias connecting the top and bottom layers to reduce thermal resistance. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, ensure that the device is properly heatsinked, and the junction temperature (Tj) is kept below the maximum rating of 150°C. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heatsink.
When selecting a heatsink for the BDW93C, consider the device's power dissipation, ambient temperature, and airflow. A heatsink with a high thermal conductivity, such as copper or aluminum, and a large surface area is recommended. Also, ensure the heatsink is properly mounted and secured to the device.
To protect the BDW93C from EOS, use a combination of TVS (transient voltage suppression) diodes and resistors in series with the input pins to limit voltage transients. Additionally, ensure that the device is operated within the recommended voltage and current ratings.
The recommended soldering conditions for the BDW93C are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350-370°C. Ensure that the device is handled and stored in accordance with the JEDEC J-STD-020 standard.
BDW93C datasheet
by STMicroelectronics
