BDW83C datasheet by STMicroelectronics

BDW83C Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
• How do I ensure reliable operation at high temperatures?
  Implement a thermal management strategy, such as heat sinks, thermal interfaces, or fans. Ensure the device is operated within the recommended temperature range (–40°C to 150°C) and consider derating the device for high-temperature applications.
• What are the recommended input and output capacitors for the BDW83C?
  Use X7R or X5R ceramic capacitors with a minimum capacitance of 10uF for input and output filtering. Ensure the capacitors are rated for the maximum operating voltage and have a low ESR (Equivalent Series Resistance).
• How do I minimize electromagnetic interference (EMI) in my design?
  Use a shielded enclosure, keep the layout compact, and minimize loop areas. Ensure proper grounding, decoupling, and filtering. Consider using a common-mode choke or ferrite beads to reduce EMI emissions.
• What is the recommended startup sequence for the BDW83C?
  Apply the input voltage (VIN) first, followed by the enable signal (EN). Ensure the input voltage is stable before applying the enable signal. A soft-start circuit can be used to reduce inrush current.