BD52E29G-MTR datasheet by ROHM Semiconductor

BD52E29G-MTR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
• How do I ensure stable operation with a high-ESR output capacitor?
  ROHM recommends using an output capacitor with an ESR of 10Ω or less to ensure stable operation. Additionally, a 1μF or larger ceramic capacitor in parallel with the output capacitor can help improve stability.
• What is the maximum allowed voltage on the EN pin?
  The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the device.
• Can I use the BD52E29G-MTR in a high-temperature environment?
  The BD52E29G-MTR is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. ROHM recommends derating the output current and voltage according to the temperature derating curve in the datasheet.
• How do I calculate the power dissipation of the BD52E29G-MTR?
  The power dissipation of the BD52E29G-MTR can be calculated using the formula: Pd = (Vin - Vout) x Iout + (Vin x Iq), where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current.