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    Part Img BC550C datasheet by NXP Semiconductors

    • BC550C - NPN general purpose transistors - Complement: BC557C ; fT min: 100 MHz; hFE max: 800 ; hFE min: 420 ; IC max: 100 mA; Polarity: NPN ; Ptot max: 500 mW; VCEO max: 45 V
    • Original
    • Yes
    • Unknown
    • Obsolete
    • EAR99
    • Find it at Findchips.com
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    BC550C datasheet preview

    BC550C Frequently Asked Questions (FAQs)

    • The maximum safe operating area (SOA) for the BC550C is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance, maximum junction temperature, and power dissipation. As a general rule, it's recommended to keep the device within the specified absolute maximum ratings and to ensure that the power dissipation does not exceed the maximum allowed value.
    • To ensure the BC550C is properly biased for linear operation, you should ensure that the base-emitter voltage (VBE) is within the recommended range (typically around 0.65-0.75V) and that the collector-emitter voltage (VCE) is within the specified range (typically up to 45V). Additionally, you should ensure that the base current is sufficient to maintain the desired collector current, and that the device is operated within its recommended temperature range.
    • The recommended PCB layout and thermal management for the BC550C involve using a thermal pad or heat sink to dissipate heat, keeping the device away from other heat sources, and using a low-thermal-resistance PCB material. Additionally, it's recommended to use a copper pour or thermal vias to help dissipate heat, and to ensure that the device is mounted securely to the PCB to minimize thermal resistance.
    • To handle ESD protection for the BC550C, you should ensure that the device is handled and stored in an ESD-safe environment, and that ESD protection devices (such as TVS diodes or ESD protection arrays) are used in the circuit to protect the device from electrostatic discharge. Additionally, you should ensure that the device is properly grounded and that the PCB is designed with ESD protection in mind.
    • The reliability and lifespan expectations for the BC550C are dependent on various factors such as operating conditions, temperature, and usage. However, NXP Semiconductors provides reliability data and failure rates for the device in the datasheet and application notes. As a general rule, it's recommended to follow proper design and manufacturing guidelines to ensure the device operates within its specified ratings and to minimize the risk of premature failure.
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