BAT60JFILM datasheet by STMicroelectronics

BAT60JFILM Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the BAT60JFILM?
  The recommended PCB footprint for the BAT60JFILM is a rectangular pad with a size of 1.3 mm x 0.6 mm, with a thermal pad of 1.1 mm x 0.4 mm. The pad should be solder-mask defined (SMD) with a non-solder-mask-defined (NSMD) thermal pad.
• How do I ensure reliable soldering of the BAT60JFILM?
  To ensure reliable soldering of the BAT60JFILM, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pad. Use a soldering technique that minimizes the thermal stress on the component.
• What is the maximum operating temperature range for the BAT60JFILM?
  The maximum operating temperature range for the BAT60JFILM is -40°C to 150°C. However, the device can withstand short-term excursions up to 175°C during soldering or other manufacturing processes.
• How do I handle the BAT60JFILM during storage and shipping?
  Handle the BAT60JFILM with care to prevent mechanical stress, bending, or twisting. Store the components in their original packaging or in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the components to extreme temperatures, humidity, or physical shock.
• What are the ESD protection requirements for the BAT60JFILM?
  The BAT60JFILM is an electrostatic discharge (ESD) sensitive device. Handle the component with ESD-protective equipment, such as wrist straps, mats, or bags, to prevent damage from static electricity.