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    Part Img BAP65-02,135 datasheet by NXP Semiconductors

    • Silicon PIN diode - C<sub>d</sub> typ.: 0.23@VR=20V AND F=1MHz0.37@VR=1V and F=1MHz0.52@VR=0V and F=1MHz pF; Configuration: Single ; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 0.95@IF=5mA Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 0.9 Ohm; R<sub>d</sub> NOTE2: 0.9 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 0.17 ; t<sub>L</sub> NOTE6: 0.17 &micro;s; V<sub>R</sub> max: 30 V; Package: SOD523 (SC-79); Container: Tape reel smd
    • Original
    • Yes
    • Unknown
    • Not Recommended
    • EAR99
    • 8541.10.00
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    BAP65-02,135 datasheet preview

    BAP65-02,135 Frequently Asked Questions (FAQs)

    • NXP provides a recommended PCB layout in the application note AN11160, which includes guidelines for component placement, trace routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
    • The input capacitor selection depends on the input voltage, output voltage, and output current requirements. A general guideline is to choose a capacitor with a voltage rating of at least 1.5 times the input voltage, and a capacitance value between 1uF to 10uF. NXP recommends using a low-ESR capacitor, such as an X7R or X5R type, to minimize voltage ripple and ensure stable operation.
    • The BAP65-02,135 has an operating temperature range of -40°C to +125°C, but the maximum junction temperature (Tj) should not exceed 150°C. It's essential to ensure proper thermal management, such as using a heat sink or thermal pad, to prevent overheating and ensure reliable operation.
    • Yes, the BAP65-02,135 is qualified for automotive and high-reliability applications. It meets the requirements of the Automotive Electronics Council (AEC) and is compliant with the ISO/TS 16949 standard. However, it's essential to follow NXP's guidelines for design, manufacturing, and testing to ensure the device meets the specific requirements of the application.
    • NXP provides a troubleshooting guide in the application note AN11160, which covers common issues and their possible causes. It's essential to follow a systematic approach to identify and resolve the issue, including checking the input voltage, output load, and PCB layout, as well as verifying the component values and soldering quality.
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