A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF signal traces short and away from noisy digital signals. Use a 50-ohm microstrip or coplanar waveguide for the RF signal lines.
Use a Smith chart or an impedance tuner to optimize the impedance matching. The recommended impedance is 50 ohms. You can use a pi-network or a T-network topology for impedance matching.
The maximum power handling of the BALF-SPI-01D3 is +33 dBm (2W). Exceeding this power limit may cause damage to the component.
Use a shielded enclosure, keep the RF signal lines away from noisy digital signals, and use a common-mode choke or a ferrite bead to filter out noise. Also, ensure good grounding and decoupling in your design.
The operating temperature range of the BALF-SPI-01D3 is -40°C to +85°C. Operating outside this range may affect the component's performance and reliability.
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