The recommended PCB layout for the BAL-NRF02D3 is a 4-layer PCB with a solid ground plane on the bottom layer, and a microstrip line on the top layer. The component should be placed on the top layer, and the RF signal should be routed on the top layer as well.
To optimize the BAL-NRF02D3 for best performance, ensure that the input and output impedances are matched to 50 ohms, and that the component is properly decoupled with capacitors. Additionally, use a high-quality PCB material with low loss tangent and ensure good soldering and assembly.
The maximum power handling of the BAL-NRF02D3 is 30 dBm (1 Watt). Exceeding this power level may cause damage to the component.
The BAL-NRF02D3 is optimized for 2.4 GHz frequency band, but it can be used for other frequencies in the 2-3 GHz range with some degradation in performance. However, it's not recommended to use it for frequencies outside this range.
To troubleshoot issues with the BAL-NRF02D3, check the PCB layout and assembly for any defects or errors. Verify that the component is properly decoupled and that the input and output impedances are matched. Use a network analyzer or a spectrum analyzer to measure the component's performance and identify any issues.
BAL-NRF02D3 datasheet
by STMicroelectronics
