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    BAL-2690D3U datasheet by STMicroelectronics

    • Balun, RF/IF and RFID, BALUN TRANSFORMER FLIPCHIP
    • Original
    • Yes
    • Unknown
    • Obsolete
    • EAR99
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    BAL-2690D3U datasheet preview

    BAL-2690D3U Frequently Asked Questions (FAQs)

    • STMicroelectronics provides a recommended PCB layout in the application note AN5156, which includes guidelines for component placement, routing, and grounding to minimize electromagnetic interference (EMI) and ensure optimal performance.
    • The BAL-2690D3U is a versatile balun that can be used in various configurations. To choose the correct configuration, consider the frequency range, impedance matching, and signal amplitude requirements of your application. STMicroelectronics provides a balun selection guide (AN5155) that can help with this process.
    • The BAL-2690D3U is rated for operation from -40°C to +125°C, but the maximum operating temperature range may vary depending on the specific application and environmental conditions. It's essential to consider the thermal management and derating factors when designing with this component.
    • Impedance matching is critical for optimal performance. STMicroelectronics provides a impedance matching calculator tool that can help you determine the correct impedance values for your specific application. Additionally, the datasheet provides guidance on impedance matching and suggests using a pi-network or a T-network for impedance matching.
    • STMicroelectronics provides a soldering and assembly guide (AN5275) that outlines the recommended techniques for soldering and assembling the BAL-2690D3U. It's essential to follow these guidelines to ensure reliable connections and prevent damage to the component.
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