B360-13-F datasheet by Diodes Incorporated

B360-13-F Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the B360-13-F?
  The recommended PCB footprint for the B360-13-F is a standard SOT23 package with a 1.3mm x 1.3mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
• How do I ensure the B360-13-F is properly biased for optimal performance?
  To ensure proper biasing, connect the input pin (VIN) to a stable voltage source, and the enable pin (EN) to a logic-level signal. The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor to minimize noise and ripple.
• What is the maximum ambient temperature range for the B360-13-F?
  The B360-13-F is rated for operation in ambient temperatures ranging from -40°C to 125°C. However, the device's performance and reliability may degrade at extreme temperatures.
• Can I use the B360-13-F in a high-reliability or automotive application?
  While the B360-13-F is a high-quality device, it is not specifically designed for high-reliability or automotive applications. For such applications, consider using devices with specific automotive or high-reliability certifications, such as AEC-Q100 or MIL-STD-883.
• How do I handle ESD protection when handling the B360-13-F?
  To prevent electrostatic discharge (ESD) damage, handle the B360-13-F with ESD-protective equipment, such as wrist straps, mats, or bags. Avoid touching the device's pins or exposed die, and ensure the device is stored in an ESD-protective package.