The recommended PCB footprint for the B180-13-F is a standard SOT23 package with a 1.3mm x 1.3mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the thermal derating curve provided in the datasheet. Additionally, ensure good thermal conduction between the device and the PCB, and consider using a heat sink if necessary.
The maximum allowable voltage for the B180-13-F is 20V. Exceeding this voltage may cause permanent damage to the device.
Yes, the B180-13-F can be used in switching regulator applications. However, ensure that the device is properly biased and that the switching frequency is within the recommended range to avoid oscillations and ensure stable operation.
The B180-13-F has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing to prevent damage to the device.
B180-13-F datasheet
by Diodes Incorporated
