B140B-13-F datasheet by Diodes Incorporated

B140B-13-F Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the B140B-13-F?
  The recommended PCB footprint for the B140B-13-F is a standard SOT23 package footprint with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
• How do I ensure the B140B-13-F is properly soldered onto the PCB?
  To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes thermal stress on the component.
• What is the maximum operating temperature range for the B140B-13-F?
  The B140B-13-F has an operating temperature range of -40°C to 125°C, but it's recommended to operate within -20°C to 85°C for optimal performance and reliability.
• Can I use the B140B-13-F in a high-reliability or automotive application?
  Yes, the B140B-13-F is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, it's essential to follow the recommended operating conditions and design guidelines to ensure optimal performance and reliability.
• How do I handle ESD protection when handling the B140B-13-F?
  To prevent electrostatic discharge (ESD) damage, handle the B140B-13-F with an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the component pins or leads to prevent ESD damage.