The recommended PCB footprint for the B130-13-F is a standard SOT23 package with a 1.3mm x 1.3mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
To ensure reliable operation in high-temperature environments, it is recommended to derate the maximum junction temperature (Tj) by 1°C for every 1W of power dissipation above 25°C. Additionally, ensure good thermal design and heat sinking to minimize thermal resistance.
The maximum allowable voltage for the B130-13-F is 30V. Exceeding this voltage may result in device damage or failure.
Yes, the B130-13-F can be used in switching regulator applications. However, ensure that the device is properly biased and that the switching frequency is within the recommended range to avoid oscillations and ensure stable operation.
To handle ESD protection for the B130-13-F, it is recommended to follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. Additionally, consider adding external ESD protection devices, such as TVS diodes, to the circuit design.
B130-13-F datasheet
by Diodes Incorporated
