A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and crosstalk.
Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Also, consider using a thermal interface material to improve heat transfer.
Critical timing parameters include clock frequency, setup and hold times, and signal rise and fall times. Ensure these parameters are met by using a clock generator with a stable frequency, and by using a signal integrity analysis tool to optimize signal routing and termination.
Use a logic analyzer or oscilloscope to capture and analyze the device's input and output signals. Check for signal integrity issues, clock frequency errors, and power supply noise. Consult the datasheet and application notes for troubleshooting guidelines.
The device requires a specific power-on sequence to ensure proper operation. Ensure that the power supplies are sequenced correctly, with the core voltage (VCC) powered up before the I/O voltage (VCCIO). Use a power management IC or a power sequencer to ensure correct power sequencing.