Broadcom recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the device should be connected to a thermal plane on the PCB.
To minimize power consumption, use the lowest possible supply voltage, reduce the clock frequency, and enable the power-down mode when not in use. Additionally, optimize the output load and termination to minimize power dissipation.
Handle the device with anti-static wrist straps, mats, and packaging. Avoid touching the device pins, and use ESD-protected workstations and tools. The device has built-in ESD protection, but it's not a substitute for proper handling and storage procedures.
The ATF-55143-BLKG is not designed for radiation-intensive environments. If your application requires radiation hardening, consider using a different device or consulting with Broadcom for custom solutions.
Broadcom provides reliability data and MTBF estimates in the device's reliability report, which can be obtained through their website or by contacting their support team.
ATF-55143-BLKG datasheet
by Avago Technologies
