Broadcom recommends a 4-layer PCB with a dedicated ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to improve heat dissipation.
To minimize power consumption, use the lowest possible supply voltage, reduce the clock frequency, and enable the power-saving features such as clock gating and dynamic voltage and frequency scaling (DVFS). Additionally, optimize the firmware to minimize active mode and use low-power modes whenever possible.
To minimize EMI and RFI, use a shielded enclosure, keep sensitive analog circuits away from the ATF-50189-TR1, and use a common-mode choke or ferrite bead on the power supply lines. Additionally, ensure proper PCB layout, decoupling, and filtering to reduce noise and radiation.
To ensure reliable operation, follow the recommended operating conditions, use a robust PCB design, and implement adequate thermal management. Additionally, consider using conformal coating, potting, or encapsulation to protect the device from moisture, vibration, and other environmental stresses.
Use a modular firmware architecture, implement robust error handling, and use debugging tools such as JTAG or serial console. Additionally, use version control, and follow a structured development process to ensure code quality and reliability.
