Broadcom recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A heat sink or thermal pad may be necessary for high-power applications.
To minimize power consumption, use the lowest possible supply voltage, reduce the clock frequency, and enable power-saving features like clock gating and dynamic voltage frequency scaling.
Handle the device with anti-static wrist straps, mats, or bags. ESD protection is built-in, but it's still essential to follow proper handling and storage procedures to prevent damage.
The ATF-50189-BLK is not specifically designed for radiation-intensive environments. If your application requires radiation hardening, consult with Broadcom or consider alternative devices.
Broadcom provides reliability data and MTBF estimates in the device's reliability report, which can be requested from their support team. The actual MTBF may vary depending on the application and operating conditions.
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