Broadcom provides a reference design guide for PCB layout and thermal management, which includes recommendations for thermal vias, heat sinks, and PCB stack-up. It's essential to follow these guidelines to ensure optimal performance and reliability.
To minimize power consumption, ensure that the device is operated within the recommended voltage range, and use the power-down mode when not in use. Additionally, optimize the clock frequency and use the built-in power-saving features, such as dynamic voltage and frequency scaling.
To minimize EMI and RFI, follow proper PCB layout and shielding techniques, such as using ground planes, shielding cans, and EMI filters. Additionally, ensure that the device is operated within the recommended frequency range and that the clock signals are properly terminated.
Use Broadcom's debugging tools, such as the Broadcom Debug Tool, to troubleshoot issues. Also, consult the device's documentation and application notes for troubleshooting guidelines. If issues persist, contact Broadcom's technical support for assistance.
The ATF-38143-TR2G has undergone various reliability and qualification tests, including temperature cycling, humidity testing, and electrical stress testing. Broadcom provides detailed information on the testing and qualification process in the device's documentation.
ATF-38143-TR2G datasheet
by Avago Technologies
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