Broadcom recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
The internal regulators can be configured using the device's registers. Broadcom recommends setting the regulators to the default values specified in the datasheet, unless specific requirements dictate otherwise. Consult the datasheet and application notes for more information.
Use a logic analyzer or oscilloscope to verify the clock signals and synchronization status. Check the device's registers and configuration settings to ensure that the clocking and synchronization are properly configured. Consult the datasheet and application notes for troubleshooting guidelines.
The device must be used in accordance with Broadcom's recommended usage guidelines and application notes. Additionally, consider implementing redundant or fail-safe designs, and perform thorough testing and validation to ensure the device meets the required reliability and safety standards.
