Broadcom recommends a 4-layer PCB with a dedicated ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the device should be connected to a thermal plane on the PCB.
Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients. Additionally, consider using a thermal sensor to monitor the device temperature and implement thermal throttling if necessary.
The input clock signal should be a differential signal with a frequency range of 25 MHz to 200 MHz, and an amplitude of 200 mV to 1.2 V. The clock signal should also have a jitter of less than 100 ps.
Configure the device to operate in the lowest power mode necessary for the application. Disable any unused features, and adjust the clock frequency and voltage to minimize power consumption. Additionally, consider using a power management IC to optimize power delivery to the device.
Handle the device with ESD-sensitive equipment and follow standard ESD protection procedures, such as using an ESD wrist strap or mat. Ensure that the device is stored in an ESD-protective package, and avoid touching the device pins or exposed internal components.
