The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the copper traces wide and short can help to reduce thermal resistance.
To ensure the device is properly biased for stable operation, make sure to provide a stable input voltage within the recommended range, and use a suitable output capacitor to filter the output voltage. Additionally, ensure that the enable pin is properly biased to either VCC or GND, and that the device is not operated in a state where the output voltage is higher than the input voltage.
The maximum output current that can be safely drawn from the device is 1.8A, as specified in the datasheet. However, it's recommended to derate the output current based on the ambient temperature and the PCB layout to ensure reliable operation.
To protect the device from overvoltage and undervoltage conditions, consider adding overvoltage protection (OVP) and undervoltage lockout (UVLO) circuits to the input voltage rail. Additionally, ensure that the input voltage is within the recommended range, and use a suitable input capacitor to filter the input voltage.
The recommended input capacitor value and type for optimal performance is a 10uF to 22uF X5R or X7R ceramic capacitor, placed as close to the device as possible. This helps to filter the input voltage and reduce noise and ripple.
