The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 20mm x 20mm, and ensuring that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
To ensure the stability of the output voltage, it is recommended to use a minimum output capacitance of 10uF with an ESR of less than 1 ohm, and to place the output capacitor as close to the output pin as possible.
Although the datasheet specifies a maximum input voltage of 18V, it is recommended to limit the input voltage to 15V to ensure reliable operation and to prevent damage to the device.
Yes, the AP7361-10E-13 is rated for operation up to 125°C, but it is recommended to derate the output current and to ensure good thermal design to prevent overheating.
The power dissipation of the device can be calculated using the formula Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
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