The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane, using thermal vias to connect the exposed pad to the ground plane, and keeping the copper traces as short and wide as possible to minimize thermal resistance.
To ensure stable output voltage regulation, it is recommended to use a high-quality output capacitor with a low ESR, place the capacitor close to the output pin, and ensure that the input voltage is within the recommended range. Additionally, the output voltage should be decoupled with a 10uF ceramic capacitor.
Although the datasheet specifies a maximum input voltage of 26V, it is recommended to limit the input voltage to 24V to ensure reliable operation and to prevent damage to the device.
The power dissipation of the device can be calculated using the formula: Pd = (Vin - Vout) x Iout + (Vin x Iq), where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current.
The recommended input capacitor value is 10uF to 22uF, and it should be a low-ESR ceramic capacitor, such as an X5R or X7R type, to ensure stable operation and to prevent oscillations.
