The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the IC, using a 2-layer or 4-layer PCB, and ensuring good copper coverage on the top and bottom layers. A minimum of 1 oz copper thickness is recommended.
To ensure stability and prevent oscillations in the output voltage, it is recommended to use a minimum output capacitance of 10uF, and to place the output capacitor close to the output pin of the IC. Additionally, the input capacitor should be placed close to the input pin, and the feedback components should be placed close to the FB pin.
The maximum input voltage that can be applied to the AP2162AFGEG-7 without damaging it is 18V. Exceeding this voltage may cause permanent damage to the IC.
The output voltage ripple and noise can be calculated using the following formula: ΔVout = (ΔIout / fsw) * (Rout / Cout), where ΔIout is the output current ripple, fsw is the switching frequency, Rout is the output resistance, and Cout is the output capacitance.
The recommended input capacitor type is a ceramic capacitor with a value of 10uF to 22uF, and a voltage rating of at least 25V. The input capacitor should be placed close to the input pin of the IC.