The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2oz copper thickness, and ensuring good thermal conduction to the surrounding copper area. A thermal via array can also be used to improve heat dissipation.
To ensure stability and prevent oscillation in the output voltage, it is recommended to use a minimum output capacitance of 10uF, with an ESR of less than 1 ohm. Additionally, the output capacitor should be placed close to the output pin, and the input capacitor should be placed close to the input pin.
Although the datasheet specifies a maximum input voltage of 12V, it is recommended to limit the input voltage to 10V to ensure reliable operation and prevent damage to the device.
While the device is rated for operation up to 125°C, it is recommended to derate the output current and input voltage at high temperatures to ensure reliable operation and prevent thermal runaway.
The power dissipation of the device can be calculated using the formula: Pd = (Vin - Vout) x Iout + (Vin x Iq), where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current.
