The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using multiple vias to dissipate heat to the other layers. A minimum of 2oz copper thickness is recommended.
To ensure stability and prevent oscillations in the output voltage, it is recommended to use a minimum output capacitance of 10uF, and to place the output capacitor close to the output pin of the AP2113AMTR-G1. Additionally, the input capacitor should be placed close to the input pin, and the feedback resistors should be placed close to the FB pin.
The maximum input voltage that can be applied to the AP2113AMTR-G1 is 18V, although the recommended maximum input voltage is 15V for optimal performance and reliability.
The AP2113AMTR-G1 is rated for operation up to 125°C, but the maximum junction temperature should not exceed 150°C. It is recommended to derate the output current and input voltage at high temperatures to ensure reliable operation.
The power dissipation of the AP2113AMTR-G1 can be calculated using the formula: Pd = (Vin - Vout) x Iout + (Vin x Iq), where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current.
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