The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using multiple vias to dissipate heat to the other layers. A minimum of 2oz copper thickness is recommended.
To ensure proper biasing, follow the recommended operating conditions in the datasheet, including the input voltage range, output current, and input impedance. Additionally, ensure the input signal is within the specified common-mode range and that the output is properly terminated.
The AP130-20RG-7 has built-in ESD protection, but handling precautions are still necessary. Use an anti-static wrist strap or mat, handle the device by the body or pins, and avoid touching the pins or die. Store the device in an anti-static bag or tube when not in use.
The AP130-20RG-7 is a commercial-grade device, but Diodes Incorporated offers other versions with enhanced reliability and automotive-grade options. Check the Diodes Incorporated website or contact their support team for more information on these options.
The recommended soldering profile for the AP130-20RG-7 involves a peak temperature of 260°C, with a maximum time above 220°C of 60 seconds. Use a soldering iron with a temperature range of 200°C to 240°C, and avoid using excessive force or pressure during soldering.
AP130-20RG-7 datasheet
by Diodes Incorporated
