The recommended PCB layout involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing thermal vias under the device. For thermal management, a heat sink or thermal pad is recommended to keep the junction temperature below 125°C.
To ensure signal integrity, use controlled impedance traces, and route high-speed signals away from noisy signals. For EMI emissions, use a shielded enclosure, and ensure the PCB is designed with EMI mitigation in mind, such as using a solid ground plane and minimizing loop areas.
The power sequencing requirements involve applying power to the device in a specific order, typically VCC, then AVCC, and finally DVCC. The voltage ramp-up rate should be controlled to avoid overshoot and ensure a stable power-on reset.
The BIST feature can be implemented by following the datasheet's instructions for enabling and executing the self-test. Testing involves verifying the device's functionality and performance using the built-in test patterns and checking the test results.
The recommended clocking and PLL configuration involves setting the clock frequency and PLL settings according to the datasheet's guidelines, taking into account the specific application's requirements and ensuring the device operates within its specified frequency range.
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