AMMP-5618-TR1 datasheet by Avago Technologies

AMMP-5618-TR1 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for optimal performance?
  Broadcom recommends a 4-layer PCB with a solid ground plane, and thermal vias under the package to dissipate heat. A thermal pad on the bottom of the package should be connected to a thermal plane on the PCB.
• How do I ensure signal integrity and minimize EMI in my design?
  Use a differential pair routing for the high-speed signals, keep the signal traces short and away from noise sources, and use a common mode filter or a pi-filter to reduce EMI.
• What is the recommended power-up sequence for the AMMP-5618-TR1?
  Power up the device in the following sequence: VCC, AVCC, and then DVCC. Ensure that the power supplies are stable and within the recommended voltage range before applying the clock signal.
• How do I troubleshoot issues with the device, such as non-functionality or incorrect output?
  Use a logic analyzer or an oscilloscope to verify the input and output signals, check the power supply voltages and clock signal, and ensure that the device is properly configured and initialized.
• Are there any specific requirements for the clock signal, such as frequency, amplitude, and jitter?
  The clock signal should be a differential signal with a frequency of 25 MHz, amplitude of 1.8 V, and jitter less than 100 ps. The clock signal should also be AC-coupled to the device.