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    AMMC-6530-W50 datasheet by Avago Technologies

    • RF Die Products, RF/IF and RFID, IC MMIC IMAGE REJECT MXR 6-30GHZ
    • Original
    • Yes
    • Yes
    • Obsolete
    • EAR99
    • 8542.39.00.01
    • Find it at Findchips.com

    AMMC-6530-W50 datasheet preview

    AMMC-6530-W50 Frequently Asked Questions (FAQs)

    • Broadcom provides a reference design guide for the AMMC-6530-W50, which includes recommendations for PCB layout, thermal management, and component placement. It's essential to follow these guidelines to ensure optimal performance, thermal stability, and minimize electromagnetic interference (EMI).
    • The AMMC-6530-W50 has various power-saving modes and configuration options. Engineers should consult the device's programming guide and application notes to understand how to optimize power consumption based on their specific use case. This may involve adjusting clock frequencies, voltage levels, and enabling/disabling specific features.
    • Broadcom provides test and measurement guidelines for the AMMC-6530-W50, including setup and configuration recommendations for various test equipment. Engineers should follow these guidelines to ensure accurate and reliable measurements of the device's performance.
    • To ensure EMC and reduce EMI, engineers should follow Broadcom's guidelines for PCB layout, component selection, and shielding. They should also consider using EMI filters, chokes, and other noise-reducing components in their design. Additionally, they should perform EMC testing and certification according to relevant industry standards.
    • The AMMC-6530-W50 has specific thermal limitations and derating considerations that engineers should be aware of. They should consult the device's datasheet and thermal management guidelines to understand the maximum operating temperatures, thermal resistance, and power derating requirements to ensure reliable operation.
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