AMGP-6434-BLKG datasheet by Avago Technologies

AMGP-6434-BLKG Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for optimal performance?
  Broadcom recommends a 4-layer PCB with a solid ground plane, and thermal vias under the package to dissipate heat. A thermal pad on the bottom of the package should be connected to a thermal plane on the PCB.
• How do I ensure signal integrity and minimize EMI in my design?
  Use a 100-ohm differential impedance for the high-speed signals, and consider using a common-mode filter or a pi-filter to reduce EMI. Also, ensure that the PCB layout follows good signal integrity practices, such as minimizing trace lengths and using shielding.
• What is the recommended power-up sequence for the device?
  The recommended power-up sequence is to apply the 1.2V core voltage (VCC) first, followed by the 3.3V I/O voltage (VCCIO). The device should be powered up in the following order: VCC, VCCIO, and then the clock signal.
• How do I configure the device for optimal power consumption?
  Configure the device to use the lowest possible power mode for the specific application. Use the power-down mode (PD) to reduce power consumption when the device is not in use. Additionally, consider using a dynamic voltage and frequency scaling (DVFS) technique to optimize power consumption.
• What are the recommended settings for the device's internal regulators?
  The recommended settings for the internal regulators are: VCC = 1.2V, VCCIO = 3.3V, and VREF = 1.2V. These settings ensure optimal performance and power consumption.