AM26LV31ESDREP datasheet by Texas Instruments

AM26LV31ESDREP Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the AM26LV31ESDREP to minimize EMI?
  A good PCB layout practice is to keep the signal traces short and away from the power planes, use a solid ground plane, and add decoupling capacitors close to the device. TI also recommends following the layout guidelines in the application note SLVAE03.
• How do I ensure the AM26LV31ESDREP is properly terminated for high-speed signals?
  Proper termination is crucial for high-speed signals. TI recommends using a series resistor (Rs) of 50-75 ohms and a parallel capacitor (Cp) of 10-22 pF for each signal line. The termination should be placed as close to the device as possible.
• What is the maximum cable length supported by the AM26LV31ESDREP?
  The maximum cable length supported by the AM26LV31ESDREP depends on the data rate and cable characteristics. As a general guideline, TI recommends keeping the cable length below 10 meters for data rates up to 100 Mbps and below 5 meters for data rates above 100 Mbps.
• How do I handle hot swapping with the AM26LV31ESDREP?
  The AM26LV31ESDREP has built-in hot swap protection, but it's still important to follow proper hot swap procedures. TI recommends using a power-on reset circuit to ensure the device is properly initialized during hot swap events.
• What is the ESD protection level of the AM26LV31ESDREP?
  The AM26LV31ESDREP has an ESD protection level of ±15 kV for human body model (HBM) and ±8 kV for charged device model (CDM).