Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    Part Img ADS7951SBDBTR datasheet by Texas Instruments

    • 12 bit, 1 MSPS,8 ch, single ended, micro power, sr i/f, SAR ADC 30-TSSOP -40 to 125
    • Original
    • Yes
    • Yes
    • Active
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
    • Powered by Findchips Logo Findchips
    • Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

    ADS7951SBDBTR datasheet preview

    ADS7951SBDBTR Frequently Asked Questions (FAQs)

    • To minimize noise and ensure accurate conversions, it is recommended to follow a star-grounding scheme, keep analog and digital grounds separate, and use a solid ground plane. Additionally, keep the analog input traces short and away from digital signals, and use a low-ESR capacitor for the AVDD pin.
    • To optimize the ADS7951SBDBTR's performance for low-power applications, use the lowest possible clock frequency, disable the internal reference voltage, and use the power-down mode when not converting. Additionally, consider using a lower AVDD voltage and reducing the input signal bandwidth.
    • The recommended calibration procedure for the ADS7951SBDBTR involves applying a known input voltage, taking multiple conversions, and calculating the gain and offset errors. Then, use these errors to correct subsequent conversions. It is also recommended to recalibrate the device periodically to account for temperature and voltage variations.
    • To handle the ADS7951SBDBTR's digital output data, use a first-in-first-out (FIFO) buffer to store the conversion results, and implement a data-ready signal to synchronize data transfer. Additionally, consider using a cyclic redundancy check (CRC) to detect data errors and ensure data integrity.
    • The ADS7951SBDBTR has a maximum junction temperature of 150°C. To ensure reliable operation over temperature, use a thermal pad or heat sink to dissipate heat, and consider using a thermally-enhanced package. Additionally, ensure that the device is operated within the recommended temperature range and that the PCB is designed to minimize thermal gradients.
    Supplyframe Tracking Pixel