A 4-layer PCB with a solid ground plane and a separate analog ground plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds. Use short, direct traces for the analog input signals, and avoid crossing digital signals over the analog signals.
Use a low-jitter clock source (<100 ps) and ensure the clock signal is properly terminated. The clock signal should be routed close to the device and away from noisy digital signals. A clock frequency of 100 MHz to 200 MHz is recommended for optimal performance.
Use a combination of ceramic and electrolytic capacitors for power supply decoupling. Place a 0.1 μF ceramic capacitor close to the device's power pins, and a 10 μF electrolytic capacitor further away. Ensure the power supply lines are well-filtered and regulated.
Use a FIFO or a buffer to handle the high-speed digital output data. Ensure the receiving device can handle the data rate and format. Use a low-skew, high-speed interface such as LVDS or CMOS to transmit the data.
Use a low-pass filter or a band-pass filter to condition the analog input signal. Ensure the filter's cutoff frequency is below the Nyquist frequency. Use a high-impedance, low-capacitance probe or a buffer amplifier to drive the analog input signal.