Broadcom recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the package should be connected to a thermal plane on the PCB.
Use a differential pair routing for the high-speed signals, keep the signal traces short and away from noise sources, and use a common mode filter or a pi-filter to reduce EMI.
Power up the device in the following sequence: VCC, AVDD, DVDD, and finally, the digital supply (VDD). Ensure that the power supplies are stable before applying the clock signal.
Consult the application note AN1234 from Broadcom, which provides guidelines for optimizing the device's performance for various applications, including ADC calibration, clocking, and signal conditioning.
Refer to the ADA-4743-BLKG programming guide, which provides detailed information on register settings, calibration procedures, and recommended values for optimal performance.
